R & D (Vertical Probe Card)
As semiconductor manufacturers continue to shrink die geometries, making the task of on-wafer testing increasingly more difficult, Xena Technologies must continuously create new and innovative testing solutions.

Xena Technologies will begin work in Q4/08 to provide a low cost vertical probing solution for customers. Vertical solution for high pitch probe cards (~125 micron) is expected by Q1/09. Xena will work to develop a fine pitch vertical solution to better assist customers and provide a complete low cost/high quality probe card solution.